ansys workbench help

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workbenchhelppdf,TSVtechnologyutilizedtoformthevertical interconnectionofthepackagehasbeenwellreported.Inthis paper,adetailedstudyhasbeendonetoanalyzetheeffectof TSVdesignonthethermalpropertiesofinterposer,and consequentlytheeffectofTSVinterposeronthepacka
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