BGA布线指导.pdf
Standard=.010”(250μm)Hole-to-Copper
Imaging-Front-to-Back=/-.002”(50μm)
Lamination-layer-to-layerregistration=/-.004”(100μm)
Drill-Drilltolerance=/-.003”(75μm)
TotalTolerance=.009”(225μm)
Advanced=.008”(200μm)Hole-to-Copper
Imaging-Front-to-Back=/-
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